Silicon Carbide Powder - High Purity for Precision Processing
Silicon Carbide Powder: 99.0% Purity, 28% Higher Precision & 30% Lower Cost
Core Specifications
|
Parameter |
Value |
Industrial Significance |
|---|---|---|
|
Chemical Composition |
SiC ≥ 99.0%, Free C ≤ 0.3%, Fe₂O₃ ≤ 0.2%, Al₂O₃ ≤ 0.15% |
Ultra-low impurities prevent precision workpiece contamination |
|
Mohs Hardness |
9.2 |
Ensures consistent polishing efficiency without rapid wear |
|
Particle Size Range |
500# - 8000# (D50: 0.5μm - 30μm, Customizable) |
Covers rough polishing to mirror-finish requirements |
|
Specific Gravity |
3.20 - 3.25 g/cm³ |
Stable suspension in polishing slurry for uniform material removal |
|
Bulk Density |
1.55 - 1.65 g/cm³ |
Easy dispersion in automated polishing systems |
|
Specific Surface Area |
1.2 - 8.5 m²/g |
Optimizes contact with workpiece for efficient polishing |
|
Water Solubility |
< 0.1% |
Stable performance in aqueous polishing solutions |
Core Advantages
Ultra-high Purity & Uniform Particle Size
With SiC purity ≥99.0% and particle size distribution deviation ≤5%, our powder avoids micro-scratches on workpieces. In semiconductor polishing tests, it reduces surface defect rate by 42% compared to standard silicon carbide powder, achieving mirror finish (Ra ≤ 0.05μm).
01
Superior Wear Resistance & Efficiency
Mohs hardness of 9.2 ensures the powder maintains polishing efficiency for 35% longer than ordinary abrasives. It increases material removal rate by 28% for ceramic workpieces, cutting polishing time for 6-inch silicon wafers from 45 minutes to 32 minutes.
02
Significant Cost Savings
Longer service life and lower defect rate reduce operating costs by 30%. Low impurity content minimizes rework expenses by 40%, and high dispersion performance cuts slurry preparation time by 22%, further lowering labor costs.
03
Stable Supply & Customization
Backed by 3 specialized micro-powder production lines and 2 purification workshops, we achieve monthly capacity of 3000 tons. 800-ton inventory covers 500#-8000# specifications, with 98% of orders delivered within 1-4 days; custom particle sizes are available in 5-7 days.
04
Application Scenarios
Semiconductor & Microelectronics Industry
Silicon wafer polishing: Precision finishing of 6-12 inch semiconductor wafers, achieving surface roughness Ra ≤ 0.05μm and flatness tolerance ≤ 1μm
LED chip substrates: Polishing of sapphire and silicon carbide substrates, improving light extraction efficiency by 18%
Semiconductor packaging: Die attach surface treatment of copper and ceramic substrates, ensuring bonding strength ≥ 30MPa
01
Advanced Ceramic Industry
Structural ceramics: Polishing of alumina and zirconia ceramic parts, increasing surface hardness by 12% and wear resistance by 25%
Electronic ceramics: Finishing of ceramic capacitors and insulators, achieving dielectric strength ≥ 25kV/mm
Bioceramics: Polishing of dental ceramics and orthopedic implants, ensuring smooth surface to reduce tissue irritation
02
Optical & Glass Industry
Optical lenses: Polishing of glass and quartz lenses, achieving transmittance ≥ 99.2% and surface accuracy λ/10
Display panels: Finishing of LCD and OLED glass substrates, removing micro-defects to ensure uniform light transmission
Optical fibers: Polishing of fiber optic connectors, reducing insertion loss to ≤ 0.1dB
03
Metallurgical & New Material Industry
Metal matrix composites: Reinforcement phase in aluminum and copper matrix composites, increasing tensile strength by 35%
Hard alloy tools: Polishing of tungsten carbide cutting tools, extending service life by 40%
Thermal spray coatings: Component in wear-resistant coatings for industrial rollers, reducing wear rate by 50%
04
Quality & Production Strength
-
Quality Certification & Testing
Our silicon carbide powder has passed ISO 9001:2015 quality certification, SGS impurity content testing, and SEMI C12-0701 semiconductor material standards. Each batch undergoes 15 strict inspections, including laser particle size analysis, X-ray fluorescence spectrometry, and scanning electron microscopy, with a qualified rate of 99.9%.
We provide customized quality reports for semiconductor clients to meet ISO 14644-1 Class 5 cleanroom requirements.
-
Inventory & Production Capacity
Production facilities: 3 automated micro-powder production lines, 2 ultra-purification workshops, 1000㎡ cleanroom
Monthly production capacity: 3000 tons (1800 tons of standard grades, 1200 tons of high-purity grades)
Regular inventory: 800 tons (covering 500#-8000#; 25kg/bag vacuum packaging)
Lead time: 1-3 days for in-stock products; 5-7 days for custom particle sizes/packaging
Quality control: Real-time monitoring from raw material purification to finished product packaging
Customer Cases & Feedback
"We use this silicon carbide powder for 8-inch silicon wafer polishing. Its uniform particle size reduces our wafer defect rate from 1.8% to 0.4%, and the polishing efficiency is 28% higher than our previous supplier. The stable supply ensures our 24/7 production line runs smoothly."
- Dr. Akira Yamamoto, Process Director at a Japanese Semiconductor Company
"As an LED substrate manufacturer, we need high-purity powder for sapphire polishing. This product's 99.2% SiC purity and low impurities help us achieve 99.3% light transmittance, up from 97.5% before. The cost per substrate has decreased by 25%-a great competitive edge."
- Lin Wei, Production Manager at a Chinese LED Material Enterprise
"Our factory produces zirconia ceramic parts for medical devices. This silicon carbide powder polishes parts to Ra 0.08μm, meeting medical-grade standards. Its wear resistance means one batch lasts 3 times longer than ordinary powder, cutting our abrasive costs by 30% annually."
- Marco Bianchi, Quality Director at an Italian Medical Ceramic Factory
Basic Info
Product Description
Size: 0-1mm; 0-3mm; 0-10mm; 1-10mm,etc.
The specifications and size can according to customer's requirement.
Uses
The Silicon Carbide, also known as emery, is a hard compound containing silicon and carbon. The addition of silicon carbide can prevent carbide precipitation, increase the amount of ferrite, make the cast iron structure dense, significantly improve the processing performance and make the cutting surface smooth. Increase the number of graphite balls per unit area of ductile iron to improve the nodularization rate. It also has a good effect on reducing non-metallic inclusions and slag, eliminating shrinkage porosity, and eliminating subcutaneous porosity.
Product Package
1. 1MT big bags.
2. 25KG small bags into 1MT big bags.
3. Iron drums.
The packaging can according to customer's requirement.
Company Information
Zibo Shengxiang Guanghe Metal Products Co., Ltd. was founded in 2001. It is located in Zibo Luzhong Porcelain Capital, south of Jinan-Qingdao Expressway. It is a specialized pretreatment steel grit factory. It is one of the suppliers of China Pretreatment Steel Grit in China. The high-quality, multi-functional and multi-variety production pattern of five series of steel shot, steel grit, copper and aluminum shot, steel wire cut shot, iron shot and iron sand adopts advanced.It is one of the main suppliers of China Fine Powder Abrasive.
Trust & After-Sales Service
Free Sample Available
Professional Technical Support
Global Logistics & Distribution
hornor we won
FAQ:
Q: Do you provide samples?
A: Yes, we could provide samples.
Q: Is the sample free?
A: Yes, samples are free of cost.
Q: How many days for sampling?
A: 7~10 days for regular size we have.
Q: How many days for production?
A: 10~30 days according to the size and quantity.
Q:What is the production capacity of your company?
A: The company's production capacity is 80-100 tons per day.
Q: Could we put our own logo?
A: Of course, the customer logo can be affixed to the packaging in the way the customer wants.
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